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Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging. Shape 3DIC, hybrid bonding, and FO-WLP innovations in next-gen nanotechnology.
🔍 Job Details
| Field | Details |
|---|---|
| Title | DMTS Process Integration Engineer – Advanced Package Technology Development (APTD) |
| Organization | Micron Technology, Inc. |
| Work Location | Boise, Idaho, USA |
| Research Field | Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical Engineering |
| Funding Info | Industry-funded (Micron) |
| Application Deadline | Rolling |
| Posted Date | July 2025 |
| Country | United States |
| Researcher Profile | Advanced process integration expert in semiconductors |
| Apply Button | Apply Now |
| Required Qualification | MS or PhD in Engineering, Physics, Chemistry, or related fields |
| Required Experience | Experience in DRAM/NAND/3DIC, hybrid bonding, integration, and yield optimization |
| Salary Details | Competitive with US-based benefits |
Micron Technology, a global leader in advanced memory and storage, is hiring a DMTS Process Integration Engineer for its Advanced Packaging Technology Development (APTD) team in Boise, Idaho.
This is a senior role ideal for engineers passionate about nanotechnology, 3DIC integration, hybrid bonding, and yield enhancement in next-gen memory packaging solutions. You’ll help define Micron’s packaging roadmap through hands-on process development, line monitoring, and statistical analysis — all while driving cross-functional projects in the semiconductor integration space.
About the Team
Micron’s TD division is where groundbreaking innovation begins. From DRAM to 3D NAND and beyond, the TD team transforms novel ideas into manufacturing-ready solutions, pushing the limits of memory technology through collaborative R&D.
Key Responsibilities
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Lead process integration efforts in 3DIC, hybrid bonding, FO-WLP, and other packaging innovations
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Develop line monitoring methods, yield improvement plans, and statistical process controls
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Design and analyze experiments (DoEs) using advanced analytics and system tools
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Drive cross-site project coordination, communication, and technology transfer
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Mentor early-career engineers, lead KT problem-solving, and contribute to training sessions
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Define contingency plans, build integration flows, and align direction with global teams
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Present findings across teams and publish ECN and change documentation
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Translate design goals into process innovation across integration domains
Required Qualifications
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MS or PhD in Electrical, Mechanical, Materials, Computer Engineering, Physics, or Chemistry
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Strong background in Advanced Packaging, DRAM, NAND, 3DIC, hybrid bonding, or FO-WLP
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Proficiency in data analysis, JMP/system tools, and process diagnostics
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Leadership and communication skills across cross-functional R&D and manufacturing teams
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Adaptability in dynamic, high-tech environments
Micron offers a collaborative, innovation-first culture with robust benefits including healthcare plans, paid time off, global learning opportunities, and long-term career development.
By joining this team, you’ll help bridge the gap between front-end process development and advanced packaging integration — fueling memory performance and efficiency for AI, 5G, and edge computing systems.
Reference & Application
🔗 Micron Careers – Process Integration Engineer APTD
📩 For queries: [email protected]
🚨 Disclaimer:
Micron does not charge candidates any fees. AI-assisted resumes are welcome but must reflect accurate experience. Misrepresentation may lead to disqualification. All applications are subject to Micron’s equal opportunity and labor compliance policies.
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