508
Micron Technology, a global leader in memory and storage innovation, is seeking a highly skilled Engineer for the High Bandwidth Memory (HBM) Product Engineering – Media Health Manufacturing team. This role is at the forefront of nanotechnology-enabled heterogeneous integration, focusing on stacked DRAM and interface die for next-generation HBM products. The position offers opportunities to develop manufacturing test flows, enhance device yield, and implement design-for-test strategies that directly influence quality, cost, cycle time, and scalability.
🔍 Job Details
| Title | Engineer – Media Health Manufacturing, Product Engineering (HBM) |
|---|---|
| Organization | Micron Technology, Inc. |
| Work Location | Singapore |
| Research Field | Semiconductor Product Engineering, Nanotechnology, DRAM & Stacked Die |
| Funding Info | Full-time salaried role (compensation per Micron policy) |
| Application Deadline | Not specified – Apply ASAP |
| Posted Date | August 2025 |
| Country | Singapore |
| Researcher Profile | Experienced Engineers in Semiconductor/Nanotechnology |
| Required Qualification | Bachelors/Masters in Electrical/Electronics Engineering or related |
| Required Experience | DRAM device physics, CMOS fundamentals, yield optimization, DFT strategy, data analysis |
| Salary Details | As per Micron Singapore compensation structure |
| Apply Button | Apply Here |
Detailed Blog Article
About the Role
As part of Micron’s HBM Product Engineering – Media Health team, you will lead the development, validation, and manufacturing readiness of high-performance, high-density stacked DRAM and interface die products. These cutting-edge devices rely on nano-scale heterogeneous integration techniques to achieve unprecedented bandwidth, efficiency, and scalability.
Your contributions will focus on:
-
Test coverage optimization for next-gen HBM architectures and process nodes
-
Manufacturing flow innovation to reduce cost, improve cycle time, and enhance quality
-
Design-for-Test (DFT) strategies to drive competitive advantage
-
Circuit-level debugging and analysis to improve intrinsic and extrinsic reliability
Key Responsibilities
-
Develop and validate manufacturing test flows for stacked DRAM/interface die HBM products
-
Characterize and qualify new products through in-depth circuit and reliability analysis
-
Improve device yield via test optimization, root-cause analysis, and innovative solutions
-
Support design verification using CAD tools and Verilog simulations
-
Lead cost and cycle-time reduction projects without compromising product quality
-
Drive cross-functional collaboration with Fab, Design, Technology Development, Test Engineering, and Reliability teams
-
Mentor junior engineers and promote a culture of technical excellence and innovation
Required Qualifications & Skills
-
Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related
-
Solid understanding of CMOS technology and DRAM device physics
-
Experience in product engineering and yield improvement strategies
-
Proficiency in statistics, data analysis tools, and scripting
-
Strong leadership, problem-solving, and communication skills
-
Proven ability to work across disciplines and manage complex engineering challenges
Why Join Micron Singapore?
-
Be at the center of innovation in semiconductor nanotechnology and high-bandwidth memory
-
Work on industry-leading DRAM and heterogeneous integration technologies
-
Access state-of-the-art manufacturing facilities and advanced analysis tools
-
Collaborate with global teams to deliver next-generation memory solutions
-
Contribute to sustainability and quality excellence in semiconductor production
Reference Links
Disclaimer
Information provided is based on official Micron job descriptions at the time of writing. Applicants should confirm all details on Micron’s careers website before applying.
Apply Now
Table of Contents